Direct Copper Interconnection for Advanced Semiconductor Technology
In the “More than Moore” era, performance requirements for leading edge semiconductor devices are demanding extremely fine pitch interconnection in semiconductor packaging.
Specificaties
| ISBN/EAN | 9781032528236 |
| Auteur | Dongkai Shangguan |
| Uitgever | Van Ditmar Boekenimport B.V. |
| Taal | Engels |
| Uitvoering | Gebonden in harde band |
| Pagina's | 448 |
| Lengte | |
| Breedte |